Overview
Applications
Comparison

Chemical formula

※PA6T
Specific gravity
1.13 (PA6T)

Thermal properties
N/A
Tg(℃)
315
Tm(℃)

Characteristics

Heat resistance

Mechanical properties

Low water absorption

Chemical resistance

Sliding property

Moldability
Commentary
UnlikePA6 and PA66, PA6T incorporates an aromatic ring in its molecular chain, resulting in a high melting point and high strength.
PA6T: polycondensation of hexamethylenediamine with terephthalic acid
・PA9T:polycondensation ofC9diamine with terephthalic acid
・PA MXD6: polycondensation of meta-xylenediamine with adipic acid
Key points
- Semi-aromatic PA reinforced with glass fiber, etc.has high stiffness, low coefficient of linear expansion and water absorption, low dimensional/strength change and good for with metal insert process.
- High heat resistance, used for electrical and electronic parts compatible with lead-free solder.
- Aramid, a fully aromatic structure, is even High strength and difficult to mold (Kevlar fibers are generally well-known)

Medical Electrocautery

Reason for adoption
Its can be molded that long, thin forceps-like arms comparable to those of metal instruments (excellent rigidity, strength and fluidity), gamma ray resistant sterilization
Source www.solvay.comSurface Mount LED Reflector

Reason for adoption
Heat resistance to withstand surface mount technology (high heat resistance)
Automotive crashworthy armor module

Reason for adoption
Excellent specific strength and impact resistance of polymers, reduced number of parts and weight by injection molding
Source PressReleaseFinder


Crystalline

Polyethylene

Polypropylene

Polyethylene
Terephthalate

Polyoxymetylene /
Polyacetal

Polybutylene
Terephthalate

Polyamide 6 /
Polyamide 66

Syndiotactic
Polystyrene

Poly Phenylene Sulfide

Polyphthalamide

Liquid Crystal Polymer

Fluorocarbon Polymers

Polyether-etherketone

Polymethyl-pentene