Overview
Applications
Comparison
Chemical formula
Specific gravity
1.27
Thermal properties
217
Tg(℃)
N/A
Tm(℃)
Characteristics
Heat resistance
Mechanical properties
Flame retardancy
Low smoke generation
Chemical resistance
Brownish transparency
Hydrolysis resistance
Flow ability
Commentary
It is obtained by synthesizing 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane and m-phenylenediamine in the presence of organic solvents. It combines imide bonding (excellent heat resistance and strength) with ether bonding (good processability).
Key points
- It is used for aircraft interior parts because of its high flame resistance and low smoke and toxic gas emission even if it burns.
- It has similar performance to sulfone super engineering plastics, and PEI is selected for applications and processes where sulfur should be avoided.
Fiber Optic Communication Connectors
Reason for adoption
Near-infrared transparency, withstands PCB reflow soldering (260°C) without filler reinforcement (heat resistance, low coefficient of linear expansion, dimensional stability)
Source PressReleaseFinderWDM (wavelength division multiplexing) module
Reason for adoption
High level infrared transmittance (over 88% at 850-1550nm), high refractive index, dimensional stability at high temperatures, more design flexibility than aspherical glass lenses, mass production and high speed production are possible.
Source PressReleaseFinderAR Smart Glasses Temples
Reason for adoption
Thinner temples with a balance of ductility and rigidity (to reduce weight and provide space for electronic components)
Source PressReleaseFinder
Crystalline
Polyethylene
Polypropylene
Polyethylene
Terephthalate
Polyoxymetylene /
Polyacetal
Polybutylene
Terephthalate
Polyamide 6 /
Polyamide 66
Syndiotactic
Polystyrene
Poly Phenylene Sulfide
Polyphthalamide
Liquid Crystal Polymer
Fluorocarbon Polymers
Polyether-etherketone
Polymethyl-pentene
