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PAI

Poly Amide Imide

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Overview

Applications

Comparison

Chemical formula

Specific gravity

1.42

Thermal properties

275

Tg(℃)

N/A

Tm(℃)

Characteristics

Ultra heat resistance

Impact resistance

Fatigue resistance

Sliding resistance

Low CTE

Low creep

Chemical resistance

Moldability

Commentary

It is synthesized by the decarboxylation reaction of trimellitic anhydride and methylene diphenyl isocyanate. In order to improve the moldability of PI (polyimide), an amide bond is incorporated into the main chain.

Key points

Although it is amorphous, it has chemical resistance and abrasion resistance, and can withstand high continuous use temperatures (approximately 275°C), so it is used in sliding gears that can withstand high temperatures.

To make molding easier, the molding process is carried out with a relatively low molecular weight, and a post-cure process is carried out to improve the performance of the molded parts.

If molding is interrupted or the molding cycle is too long, there is a risk that hardening will begin inside the cylinder.

使われ方

Labyrinth Seal

Reason for adoption

Dimensional stability (low coefficient of linear expansion, creep resistance), corrosion resistance, friction and wear resistance under all temperature environments

Source　Solvay Specialty Polymers Japan

Aircraft Engine Shroud

Reason for adoption

Weight reduction by metal substitution

Source　Solvay Specialty Polymers Japan

Aircraft Connectors

Reason for adoption

Toughness and thermal properties for long-term use, excellent flame resistance and electrical insulation

Source　Solvay Specialty Polymers Japan

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