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• #Conductive Materials
• #Coating Materials
• #Inks
• #Paints
• #Automotive
• #Automotive Displays
• #TV
• #Monitors
• #Electronic Components
• #Circuit Boards

DENATRON is a transparent conductive coating material. There are two types: Type-P, based on the polythiophene conductive polymer "PEDOT:PSS", Type-C, based on carbon nanotubes. They can be used in a wide range of applications from antistatic coatings to transparent conductive electrodes. Specifically, as a top brand* with over 20 years of manufacturing experience in case of antistatic optical film, we have been honing our expertise about development, manufacturing, and quality control. (*Based on our research on adoption in related markets) For more information, please visit the featured product site (DENATRON site)

• #Building Materials
• #Paints
• #Inks
• #Adhesives
• #Coating Materials
• #Disposable Diapers
• #Hygiene Materials
• #Automotive
• #Electronic Components
• #Aircraft

DENACOL is a collective term for special epoxy compounds synthesized using our advanced organic synthesis technology. These compounds are glycidyl ether or ester derivatives of various alcoholic hydroxyl groups and organic acids. We offer a diverse lineup of products, ranging from monofunctional to multifunctional epoxy compounds. Taking advantage of the high reactivity of epoxy groups, our products are used in a wide range of applications. In particular, we provide extensive lineup of water-soluble epoxy compounds. We also offer "Green DENACOL", a bio-based epoxy compound made from plant-based raw materials, as well as low-chlorine types with significantly reduced chlorine content. For more information, please visit the featured product site (DENACOL site)

• #IC

Liquid and sheet type epoxy encapsulation materials for semiconductors. These materials have a strong track record in the mass production of semiconductor wafer-level packages (WLP) with low temperature curing, low warpage and high fluidity. We provide solutions that achieve both reliability and high performance by utilizing molding equipment and developing materials optimized for customer processes.

• #High-Frequency Devices

This is an encapsulant for RF modules designed to support miniaturization and high density mounting. it is available in both liquid and sheet types and maintains high fluidity even under low temperature and low-pressure conditions, enabling damage free molding of components. Furthermore, by utilizing molding equipment and developing materials optimized for customer processes, we provide solutions that achieve both reliability and performance.

• #Power Semiconductors

This is a highly fluidity, low viscosity epoxy encapsulant for power modules. It controls internal stress during thermal cycles, ensuring excellent adhesion and high durability. It offers high reliability, meeting TST, PCT and THB test requirements. Additionally, it is halogen free and flame retardant at the V-0 level, complying with environmental regulations.

• #Display
• #Imaging Materials

This is a highly reliable material for optical devices. Its compatibility with UV curing and low temperature curing enables use in a wide variety of manufacturing process. It has a strong track record as a peripheral seal for image sensors and displays, offering high adhesion to precision components and excellent durability.

• #High-Frequency Devices

Epoxy sheet encapsulant enables compatibility with complex shapes and fine structures through highly accurate fluidity control. We provide optimized encapsulation solutions for a wide range of applications by achieving multi-layered structures that integrate various functions. It is available in multiple supply formats, including rolls, sheets, and varnish, and can be flexibly adapted to the customer's manufacturing process.

• #Electronic Components
• #Display

This is a sheet-type flux with a component-catch function. its uniform film thickness ensures consistent flux supply, making quality control easier and helping to improve bonding defects, ultimately leading to higher yields. Additionally, it is water-washable, reducing environmental impact.

• #Transport Equipment
• #Building Materials
• #Display
• #FRP
• #General Electronic Components Encapsulation
• #High-Insulation Compounds
• #Structural Materials
• #High-Frequency Devices
• #Electronic Components
• #Power Semiconductors
• #Automotive
• #Automotive Displays
• #Transport Equipment
• #Aircraft
• #Circuit Boards

This is specialized adhesive that provides strong bonding performance under normal use conditions while allowing for easy dismantling and removal with minimal damage to the adherend when peeling is required. The adhesive itself decomposes, enabling parts to be recovered without leaving any residue on the adherend. It is available in two types: room-temperature curing and ambient-temperature curing.

• #High-Frequency Devices

We are focusing on developing photoresists (photosensitive materials) optimized for lift-off processes. In addition to single-layer positive resists, we offer a wide range of two-layer resists that are also suitable for fine-line processing. Compared to conventional products, our two-layer resists offer the advantages of enabling low-temperature baking and making it easier to control the amount of undercut. For more information, please visit the featured product site (Lift-off Photoresist site)

• #Circuit Boards

A non-aqueous positive photoresist stripper with high stripping performance while minimizing damage to base metals such as aluminium and silicon.

• #Circuit Boards

Water-based positive photoresist stripper. Offers high stripping performance and low damage to aluminium. Classified as Non-hazardous under the Fire Service Act, making it easy to handle and manage.

• #Electronic Components

A non-aqueous rubber-based negative resit stripper that minimizes damage to metals. It has excellent stripping performance and high resist solubility. The N-530 series also includes a dedicated rinse solution, allowing us to offer the optimal product to match your manufacturing process and specific requirements.

• #Display
• #Pressure-Sensitive Adhesives
• #Adhesives
• #Automotive
• #Automotive Displays
• #Transport Equipment
• #Electronic Components
• #Circuit Boards
• #Monitors
• #Structural Materials
• #TV
• #IC

TEISANRESIN is a collective term for acrylic ester polymers manufactured using our suspension polymerization technology. It has a relatively low glass transition temperature (Tg) and a sharp molecular weight distribution. Due to its excellent insulating properties and strong adhesion reliability, it is widely used in applications such as adhesives for electronic materials, epoxy resin modifiers (e.g. improving flexibility and stress relaxation), and adhesives for surface protection films.

• #Conductive Materials
• #Circuit Boards

The OAG series is a silver nano ink that can be baked at 80℃ and exhibits excellent volume resistivity. It contains special high-density components, ensuring void-free, high adhesion. It is highly stable and can be stored at room temperature. We also provide insulation inks that can be used in combination with the OAG series. Additionally, we offer inks suitable for various printing methods, including inkjet printing, with the flexibility to adjust viscosity over a wide range.