Sealing technology adaptable to a wide range of manufacturing process with UV curing, low temperature curing, and high adhesion
A highly reliable material for optical devices. With compatibility for UV curing and low-temperature curing, it supports a wide range of manufacturing processes. It offers strong adhesion to precision components and excellent durability with a proven track record as a peripheral seal for image sensors and displays.
Solution Overview
It ensures high reliability as an encapsulation and sealing material for protecting precision components. With UV curing and low temperature curing capabilities, it adapts to various manufacturing processes while providing excellent adhesion and durability.
Challenges & Detailed Solutions
With the advancement of optoelectronic devices, improving durability and adhesion has become a key challenge. Our material utilizes UV curing and low temperature curing technology to protect precision components without damage while ensuring long-term reliability.
Features
This material supports UV curing and low temperature curing, making it adaptable to a wide range of manufacturing processes. It has a proven track record in applications such as peripheral sealing for image sensors and displays.
Applicable Products
Inquiries about our products and technology
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Inquiries