Encapsulation technology achieving low-temperature curing, low warpage, and high fluidity
This encapsulant for RF modules supports miniaturization and high-density mounting. Available in both liquid and sheet types, it maintains high fluidity even under low-temperature, low-pressure conditions, enabling damage-free molding of components. Furthermore, by leveraging molding equipment and developing materials optimized for customer processes, we provide solutions that ensure both reliability and high performance.
Solution Overview
High-density mounting of RF modules requires low-temperature curing and low-pressure molding. Our encapsulants are available in both liquid and sheet types, ensuring damage-free molding. By utilizing molding equipment, we offer optimized process solutions tailored to your requirements.
Challenges & Detailed Solutions
In RF module microstructure protection, achieving high fluidity and moldability under low-temperature, low-pressure conditions is a key challenge. Our encapsulation material meets both requirements, providing an optimized solution tailored to customers' manufacturing processes.
Features
High fluidity enables low-pressure encapsulation, while low-temperature curing minimizes warpage.
Applicable Products
Inquiries about our products and technology
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Inquiries