Liquid encapsulation technology that meets high reliability requirements with high fluidity, a halogen-free composition, and V-0 level flame retardancy
A high-fluidity, low-viscosity encapsulation material for power modules. It controls internal stress during thermal cycles, ensuring excellent adhesion and durability. With high reliability proven through TST, PCT, and THB tests, it is also halogen-free and V-0 level flame-retardant, complying with environmental regulations.
Solution Overview
For extending the lifespan of power modules, stress control during thermal cycles is crucial. Our encapsulation material offers excellent adhesion and durability, meeting TST, PCT, and THB test requirements. It is also halogen-free and provides V-0 level flame retardancy.
Challenges & Detailed Solutions
Power modules face degradation challenges due to stress from thermal cycles. Our encapsulation material offers a solution that combines long-term reliability with high adhesion and durability while ensuring environmental compliance through its halogen-free composition.
Features
This encapsulation material features high fluidity and low viscosity to control internal stress while providing excellent adhesion and durability. It offers high reliability, meeting TST, PCT, and THB test requirements, and has V-0 level flame retardancy.
Applicable Products
Inquiries about our products and technology
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