Product Information

Sealing technology adaptable to a wide range of manufacturing process with UV curing, low temperature curing, and high adhesion

A highly reliable material for optical devices. With compatibility for UV curing and low-temperature curing, it supports a wide range of manufacturing processes. It offers strong adhesion to precision components and excellent durability with a proven track record as a peripheral seal for image sensors and displays.

Technology for providing impact resistance and shock absorption

This adhesive provides impact resistance and shock absorption. It not only enhances the reliability of the final product but also increases design flexibility, allowing for a wider selection of parts and structural configurations, such as various shapes, the elimination of screw fastening, and vibration-damping materials. By fundamentally revising the material composition, we have successfully developed this solution achieving both high elasticity and high elongation.

Improving the curing speed of the coating film

DENACOL is a collective term for special epoxy compound developed using our advanced organic synthesis technology, which enables the glycidyl etherification (or esterification) of various alcoholic hydroxyl groups and organic acids. Our product lineup ranges from monofunctional to multifunctional epoxies, offering diverse options to meet various requirements. Utilizing the high reactivity of epoxy groups, these compounds are widely used across multiple applications. In particular, we provide an extensive range of water-soluble epoxy compounds. Additionally, our lineup includes "Green DENACOL," a bio-based epoxy compound made from plant-based raw materials, as well as low-chlorine variants with significantly reduced chlorine content.

Electrical insulation and ink jet technology

The OAG-series is a silver nano ink that can be baked at 80℃ and exhibits good volume resistivity.

Sheet type flux technology with component holding function

The uniform film thickness simplifies quality control, reduces bonding defects, and improves yield. Additionally, it is compatible with water-based cleaning, helping to reduce environmental impact.

Technology for bonding components at room temperature

This adhesive cures at room temperature. By using this adhesive, there is no need to install curing equipment, and the curing process can be simplified. Additionally, it contributes to reducing carbon dioxide emissions. Beyond this key feature, it can also be customized to exhibit various special properties, such as adhesiveness, elongation, and elasticity.

Endotoxin (LPS) removal contract testing service

We remove endotoxins from raw materials and ingredients used in medical devices, regenerative medicine products, and other medical applications, providing them as low-endotoxin-grade raw materials. We accommodate a wide range of orders, from lab-scale quantities of a few grams to bulk orders of several hundred kilograms.

Improving the water and chemical resistance of coating films

DENACOL is a collective term for special epoxy compound developed using our advanced organic synthesis technology, which enables the glycidyl etherification (or esterification) of various alcoholic hydroxyl groups and organic acids. Our product lineup ranges from monofunctional to multifunctional epoxies, offering diverse options to meet various requirements. Utilizing the high reactivity of epoxy groups, these compounds are widely used across multiple applications. In particular, we provide an extensive range of water-soluble epoxy compounds. Additionally, our lineup includes "Green DENACOL," a bio-based epoxy compound made from plant-based raw materials, as well as low-chlorine variants with significantly reduced chlorine content.

Technology for achieving strong adhesion between parts

This adhesive enables strong bonding between parts. It not only enhances the reliability of the final product but also increases design flexibility, allowing for a wider range of parts choices and structural configurations, such as varying shapes, screw free assembly, and elimination of vibration-damping materials.

Sheet encapsulation technology for complex shapes and microstructures with high precision flow control in sheet form

This epoxy sheet encapsulation material supports complex shapes and fine structures through highly precise fluidity control. It also enables multi-layered structures that integrate multiple functions, providing optimized solutions for a wide range of applications. Available in various supply formats, including rolls, sheets, and varnish, it flexibly adapts to diverse manufacturing processes.

Liquid encapsulation technology that meets high reliability requirements with high fluidity, a halogen-free composition, and V-0 level flame retardancy

A high-fluidity, low-viscosity encapsulation material for power modules. It controls internal stress during thermal cycles, ensuring excellent adhesion and durability. With high reliability proven through TST, PCT, and THB tests, it is also halogen-free and V-0 level flame-retardant, complying with environmental regulations.

Primer-less adhesion technology for post-vulcanization rubber

A one-coat adhesive for post-vulcanization rubber that eliminates the need for a primer. It reduces work time and process steps while achieving high adhesive strength. Additionally, it is VOC-free and environmentally friendly.

Adhesive technology enabling parts recycling for a sustainable society

This special adhesive provides strong adhesion while minimizing damage to the adherend upon peeling. After disassembly, parts can be recovered without any residue.

Resin formulation technology for high bio-content material

By optimizing the base resin, curing agent, and additives, this resin achieves both high bio-content and excellent functional performance. It helps reduce environmental impact and supports the realization of a sustainable society.

Material technology that enables lightweight resins, improved workability, and high strength, including liquid thermoplastic resins and matrix resins for FRP

We provide high-performance resin design solutions with lightweight, highly durable epoxy resins, including honeycomb potting resins and FRP matrix resins.

Encapsulation technology achieving low-temperature curing, low warpage, and high fluidity

This encapsulant for RF modules supports miniaturization and high-density mounting. Available in both liquid and sheet types, it maintains high fluidity even under low-temperature, low-pressure conditions, enabling damage-free molding of components. Furthermore, by leveraging molding equipment and developing materials optimized for customer processes, we provide solutions that ensure both reliability and high performance.

Improvement of adhesion and bonding

DENACOL is a collective term for special epoxy compound developed using our advanced organic synthesis technology, which enables the glycidyl etherification (or esterification) of various alcoholic hydroxyl groups and organic acids. Our product lineup ranges from monofunctional to multifunctional epoxies, offering diverse options to meet various requirements. Utilizing the high reactivity of epoxy groups, these compounds are widely used across multiple applications. In particular, we provide an extensive range of water-soluble epoxy compounds. Additionally, our lineup includes "Green DENACOL," a bio-based epoxy compound made from plant-based raw materials, as well as low-chlorine variants with significantly reduced chlorine content.

Improving the flexibility of cured materials

DENACOL is a collective term for special epoxy compound developed using our advanced organic synthesis technology, which enables the glycidyl etherification (or esterification) of various alcoholic hydroxyl groups and organic acids. Our product lineup ranges from monofunctional to multifunctional epoxies, offering diverse options to meet various requirements. Utilizing the high reactivity of epoxy groups, these compounds are widely used across multiple applications. In particular, we provide an extensive range of water-soluble epoxy compounds. Additionally, our lineup includes "Green DENACOL," a bio-based epoxy compound made from plant-based raw materials, as well as low-chlorine variants with significantly reduced chlorine content.

Flexible and transparent electrodes

DENATRON is a transparent conductive coating material. There are two types: Type-P, based on the polythiophene conductive polymer "PEDOT:PSS", Type-C, based on carbon nanotubes. They can be used in a wide range of applications from antistatic coatings to transparent conductive electrodes. Specifically, as a top brand* with over 20 years of manufacturing experience in case of antistatic optical film, we have been honing our expertise about development, manufacturing, and quality control. (*Based on our research on adoption in related markets)

Transparent antistatic coating film formation

DENATRON is a transparent conductive coating material. There are two types: Type-P, based on the polythiophene conductive polymer "PEDOT:PSS", Type-C, based on carbon nanotubes. They can be used in a wide range of applications from antistatic coatings to transparent conductive electrodes. Specifically, as a top brand* with over 20 years of manufacturing experience in case of antistatic optical film, we have been honing our expertise about development, manufacturing, and quality control. (*Based on our research on adoption in related markets)

Adding flexibility to resin

TEISANRESIN is a collective term for acrylic ester polymers manufactured using our suspension polymerization technology. It has a relatively low glass transition temperature (Tg) and a sharp molecular weight distribution. Due to its excellent insulating properties and strong adhesion reliability, it is widely used in applications such as adhesives for electronic materials, epoxy resin modifiers (e.g. improving flexibility and stress relaxation), and adhesives for surface protection films.

Anti electrochemical migration and insulating adhesive

TEISANRESIN is a collective term for acrylic ester polymers manufactured using our suspension polymerization technology. It has a relatively low glass transition temperature (Tg) and a sharp molecular weight distribution. Due to its excellent insulating properties and strong adhesion reliability, it is widely used in applications such as adhesives for electronic materials, epoxy resin modifiers (e.g. improving flexibility and stress relaxation), and adhesives for surface protection films.

Wiring formation, microfabrication, and heat resistance

For customers struggling to find a resist that fits their current process, we offer lift-off and etching resists with optimized properties, including viscosity, wettability, pattern shape, and heat resistance.

Precision cleaning technology

We provide precision cleaning solutions, including photoresist stripping solutions and etchants, for the semiconductor and display industries.