LMC: Liquid molding compound
Liquid and sheet type epoxy encapsulation materials for semiconductors. These materials have a strong track record in the mass production of semiconductor wafer-level packages (WLP) with low temperature curing, low warpage and high fluidity. We provide solutions that achieve both reliability and high performance by utilizing molding equipment and developing materials optimized for customer processes.
Product Overview
Liquid and sheet type epoxy encapsulation materials for semiconductors.
Benefit
We provide encapsulation solutions that achieve both reliability and high performance while supporting the mass production of wafer-level packages (WLP).
Features
We provide encapsulation solutions that achieve both reliability and high performance while supporting the mass production of wafer-level packages (WLP).
Value proposition
Encapsulation for semiconductors including wafer-level packages (WLP)
Inquiries about our products and technology
For inquiries about products (SDS, TDS, usage instructions, pricing, purchase information, catalogs, regulations, samples, etc.), technologies, and business collaboration, please check our dedicated website before submitting your inquiry.
Inquiries