Epoxy encapsulant for power module
This is a highly fluidity, low viscosity epoxy encapsulant for power modules. It controls internal stress during thermal cycles, ensuring excellent adhesion and high durability. It offers high reliability, meeting TST, PCT and THB test requirements. Additionally, it is halogen free and flame retardant at the V-0 level, complying with environmental regulations.
Product Overview
This is a highly fluidity, low viscosity epoxy encapsulant for power modules.
Benefit
It offers highly reliable and long-lasting encapsulation solutions that comply with environmental regulations.
Features
It is a highly fluidity, low viscosity encapsulant that controls internal stress ensuring excellent adhesion and durability. It offers high reliability and long-lasting performance, meeting TST, PCT and THB test requirements. Additionally, it is flame-retardant at the V-0 level.
Value proposition
Encapsulation of power module
Inquiries about our products and technology
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