Browse by Material

• #Conductive coatings DENATRON

DENATRON is a transparent conductive coating material. There are two types: Type-P, based on the polythiophene conductive polymer "PEDOT:PSS", Type-C, based on carbon nanotubes. They can be used in a wide range of applications from antistatic coatings to transparent conductive electrodes. Specifically, as a top brand* with over 20 years of manufacturing experience in case of antistatic optical film, we have been honing our expertise about development, manufacturing, and quality control. (*Based on our research on adoption in related markets) For more information, please visit the featured product site (DENATRON site)

• #FRP matrix resin
• #Adhesive
• #GREEN DENACOL
• #Special epoxy compound DENACOL
• #Tire cord crosslinking material

DENACOL is a collective term for special epoxy compounds synthesized using our advanced organic synthesis technology. These compounds are glycidyl ether or ester derivatives of various alcoholic hydroxyl groups and organic acids. We offer a diverse lineup of products, ranging from monofunctional to multifunctional epoxy compounds. Taking advantage of the high reactivity of epoxy groups, our products are used in a wide range of applications. In particular, we provide extensive lineup of water-soluble epoxy compounds. We also offer "Green DENACOL", a bio-based epoxy compound made from plant-based raw materials, as well as low-chlorine types with significantly reduced chlorine content. For more information, please visit the featured product site (DENACOL site)

• #Potting

This is a highly fluidity, low viscosity epoxy encapsulant for power modules. It controls internal stress during thermal cycles, ensuring excellent adhesion and high durability. It offers high reliability, meeting TST, PCT and THB test requirements. Additionally, it is halogen free and flame retardant at the V-0 level, complying with environmental regulations.

• #Adhesive

This is a highly elastic, high-elongation adhesive that cures at room temperature. Generally, there is a trade-off between elastic modulus and elongation, but by completely redesigning the material structure, we have successfully achieved both properties at a high level. As a result, this product is expected to be used in a variety of applications, primarily in the structural field, taking advantage of its hardness and high toughness. Additionally, since no curing process is required, it helps reduce carbon dioxide emissions and eliminates the need for dedicated equipment.

• #Adhesive

This adhesive cures at room temperature and offers exceptional bonding strength. Compared to conventional room-temperature curing grades, it provides approximately twice the adhesion strength and is compatible with various substrates, making it suitable for applications in structural components, automotive components, and beyond. Since no curing process is required, it contributes to reducing CO₂ emissions and eliminates the need for specialized equipment.

• #High insulation compound

This epoxy casting material holds the largest market share in high-voltage infrastructure applications in Japan. We established a joint venture early on with Switzerland's CIBA-GEIGY, a pioneer in epoxy resins, and have been providing high-quality materials to Japanese customers for many years. Our extensive experience and technological expertise, built over decades, are our key strengths.

• #Adhesive

This epoxy material is used in the low-current field, including automobiles and industrial equipment. In addition to adhesion and potting, we offer a lineup of partial sealing materials that leverage fluidity control technology and are used in a wide range of products.

• #Adhesive

This adhesive is part of the DENATITE series which boasts a long track record. It is well-suited for engineering plastics, which are generally considered difficult to bond. Additionally, its viscosity control technology prevents resin dripping in the Z-axis direction, enhancing flexibility in the manufacturing process.

• #Potting
• #FRP matrix resin

Structural materials used in honeycomb potting resins for aircraft parts, thermoplastic epoxy resins, matrix resins, etc. These materials are employed in applications requiring weight reduction and in various fields that contributing to the realization of a hydrogen society.

• #Adhesive

This is specialized adhesive that provides strong bonding performance under normal use conditions while allowing for easy dismantling and removal with minimal damage to the adherend when peeling is required. The adhesive itself decomposes, enabling parts to be recovered without leaving any residue on the adherend. It is available in two types: room-temperature curing and ambient-temperature curing.

• #Adhesive

This is a one-coat adhesive for vulcanized rubber that does not require primer treatment, significantly reducing the number of processes and work time. It provides the same adhesive strength as vulcanization bonding when bonding to vulcanized rubber. Additionally, the VOC-free design makes it a people- and environmentally friendly adhesive.

• #Adhesive
• #Acrylic ester copolymer TEISANRESIN

TEISANRESIN is a collective term for acrylic ester polymers manufactured using our suspension polymerization technology. It has a relatively low glass transition temperature (Tg) and a sharp molecular weight distribution. Due to its excellent insulating properties and strong adhesion reliability, it is widely used in applications such as adhesives for electronic materials, epoxy resin modifiers (e.g. improving flexibility and stress relaxation), and adhesives for surface protection films.