Wiring formation, microfabrication, and heat resistance

Utilizing our advanced formulation technology, we provide positive type photoresists optimized for your process.

We can fine-tune viscosity and wettability to ensure uniform coating at the target thickness. Taper angle adjustments are also optimized through formulation and lithography conditions. For challenges such as resist pattern deformation during the baking process, we offer high-heat-resistant resists.

If you are experiencing issues with existing resists, please feel free to consult with us.

The following parameters can be adjusted:

• Film thickness

• Viscosity

• Wettability

• Sensitivity

• Taper angle

• Etching resistance improvement

• Heat resistance improvement

General

• Positive type photoresist

• Exposure wavelength range: g-line to i-line (broadband compatible)
  

Etching Photoresist: GRX series

• Compatible with spin coater and CAP coater

• Suitable for large glass substrates

• Optimized composition improves in-plane uniformity of pattern line width

• Reduced side etching ensures excellent substrate adhesion
  

Single-Layer Lift-Off Photoresist: NPR9700 series

• Easily forms a reverse taper shape under general exposure conditions

• Improved heat resistance

• Excellent peelability

Lower Layer Etching Photoresist for Two-Layer Process: BLX series

• Low temperature bake (125℃ to 160℃ bake)

• Easy undercut control

In addition to these, we offer a wide range of other products, including high heat resistance photoresists, upper layer photoresists for two-layer processes, and photosensitive insulating films.
If you have any questions, please feel free to contact us.