Technology for bonding components at room temperature｜solutions

Solution Overview

This adhesive cures at room temperature, eliminating the need for curing equipment and streamlining the process. It also contributes to reducing CO₂ emissions. Furthermore, properties such as adhesion, elongation, and elasticity can be customized.

Challenges & Detailed Solutions

Since it cures at room temperature, curing equipment is not required, contributing to a shorter curing process and reduced carbon dioxide emissions.

Features

room temperature curing

Applicable Products

Room temperature curing adhesive: High modulus elongation type
#Adhisive
#Crosslinking・Hardening
#Dissimilar materials adhesion
#High voltage resistance
This is a highly elastic, high-elongation adhesive that cures at room temperature. Generally, there is a trade-off between elastic modulus and elongation, but by completely redesigning the material structure, we have successfully achieved both properties at a high level. As a result, this product is expected to be used in a variety of applications, primarily in the structural field, taking advantage of its hardness and high toughness. Additionally, since no curing process is required, it helps reduce carbon dioxide emissions and eliminates the need for dedicated equipment.
Room temperature curing adhesive: High adhesion type
#Adhisive
#Crosslinking・Hardening
#Dissimilar materials adhesion
#High voltage resistance
This adhesive cures at room temperature and offers exceptional bonding strength. Compared to conventional room-temperature curing grades, it provides approximately twice the adhesion strength and is compatible with various substrates, making it suitable for applications in structural components, automotive components, and beyond. Since no curing process is required, it contributes to reducing CO₂ emissions and eliminates the need for specialized equipment.
Epoxy material for low voltage electrical equipment
#Adhisive
#Crosslinking・Hardening
#High voltage resistance
#Stress relaxation
#Dissimilar materials adhesion
This epoxy material is used in the low-current field, including automobiles and industrial equipment. In addition to adhesion and potting, we offer a lineup of partial sealing materials that leverage fluidity control technology and are used in a wide range of products.
Epoxy adhesives for electronics and structural applications
#Adhisive
#Crosslinking・Hardening
#Dissimilar materials adhesion
#Stress relaxation
This adhesive is part of the DENATITE series which boasts a long track record. It is well-suited for engineering plastics, which are generally considered difficult to bond. Additionally, its viscosity control technology prevents resin dripping in the Z-axis direction, enhancing flexibility in the manufacturing process.

Technology for bonding components at room temperature

Solution Overview

Challenges & Detailed Solutions

Features

Applicable Products

Inquiries about our products and technology