Electrical insulation and ink jet technology

The OAG-series is a silver nano ink that cures at 80°C and exhibits excellent volume resistivity.

It is ideal for applications where high-temperature processing needs to be avoided during Ag wiring formation.

Formulated with specially designed high-density components, it ensures a void-free structure and strong adhesion. The ink also offers high stability and can be stored at room temperature.

Additionally, its viscosity can be adjusted across a wide range, allowing us to provide inks suitable for various printing methods, including inkjet printing.

We also offer a lineup of complementary Ag wiring inks and high-adhesion insulating inks for seamless integration.

• Low temperature curing at 80 ℃ and above

• Void less

• High adhesion

• Storable at room temperature

• Low volume resistance

• Compatible with various printing methods (inkjet, aerosol jet, gravure offset, etc.)