Adding flexibility to resin

TEISANRESIN is a material that provides stress relaxation when used as a component in adhesives or encapsulants for electronic materials. It offers greater flexibility than epoxy resins and other adhesives, allowing it to effectively absorb and relax stress.

When using adhesives and encapsulants for electronic materials, the risk of cracking and peeling due to temperature fluctuations, vibration, and mechanical stress is a major concern. TEISANRESIN has excellent flexibility and stress relaxation properties, helping mitigate these issues.

Issues

Electronic materials are composed of different materials (resins, metals, ceramics, etc.), each with distinct thermal expansion coefficients. These materials expand and contract at different rates due to temperature changes, which causes stress concentration at the adhesive interface, leading to peeling and cracking.

Solution by TEISANRESIN

• Epoxy resin modification: Reduces elastic modulus while maintaining Tg (glass transition temperature), relieving expansion and contraction stress.

• Stress relaxation function: Minimizes cracking even under thermal cycling tests.

• Heat resistance: Maintains flexibility even in high-temperature environments and resists long-term thermal degradation, contributing to the extended lifespan and improved reliability of semiconductors and power devices.

• Providing Flexibility and Stress relaxation

• Insulation reliability

• Adhesion reliability

• Heat resistance