Epoxy Sheet Encapsulant

Thumbnail Image of epoxy material sheet encapsulant

Epoxy sheet encapsulant enables compatibility with complex shapes and fine structures through highly accurate fluidity control. We provide optimized encapsulation solutions for a wide range of applications by achieving multi-layered structures that integrate various functions. It is available in multiple supply formats, including rolls, sheets, and varnish, and can be flexibly adapted to the customer's manufacturing process.

Industries

Semiconductor & Electronic Devices: High-Frequency Devices

Materials

Materials for Optical/Electronic Devices and Printed Wiring Board: Sheet encapsulant for hollow package

Solutions

Adhisive
Crosslinking・Hardening
Thermal Interface Material (TIM)
Dissimilar materials adhesion
Sheet encapsulant
Encapsulant for hollow package

Product Overview

Epoxy sheet encapsulant enables compatibility with complex shapes and fine structures through highly precise fluidity control.

Benefit

We provide optimized encapsulation solutions for a wide range of applications by achieving multi-layered structures that integrate various functions.

Features

An epoxy sheet encapsulant with highly precise fluidity control, available in multiple supply formats, including rolls, sheets, and varnish, and can be flexibly adapted to the customer's manufacturing process.

Value proposition

Hollow encapsulant for high-frequency devices

Inquiries about our products and technology

For inquiries about products (SDS, TDS, usage instructions, pricing, purchase information, catalogs, regulations, samples, etc.), technologies, and business collaboration, please check our dedicated website before submitting your inquiry.

Inquiries