Epoxy encapsulant for RF module
This is an encapsulant for RF modules designed to support miniaturization and high density mounting. it is available in both liquid and sheet types and maintains high fluidity even under low temperature and low-pressure conditions, enabling damage free molding of components. Furthermore, by utilizing molding equipment and developing materials optimized for customer processes, we provide solutions that achieve both reliability and performance.
Product Overview
This is an encapsulant for RF modules designed to support miniaturization and high density mounting.
Benefit
It provides encapsulation solutions that achieve both reliability and performance to RF modules requiring miniaturization and high density mounting.
Features
It enables warpage control through low-pressure encapsulation, thanks to its high fluidity and low temperature curing.
Value proposition
Encapsulation for module products such as RF modules.
Inquiries about our products and technology
For inquiries about products (SDS, TDS, usage instructions, pricing, purchase information, catalogs, regulations, samples, etc.), technologies, and business collaboration, please check our dedicated website before submitting your inquiry.
Inquiries