Epoxy adhesives for electronics and structural applications
This adhesive is part of the DENATITE series which boasts a long track record. It is well-suited for engineering plastics, which are generally considered difficult to bond. Additionally, its viscosity control technology prevents resin dripping in the Z-axis direction, enhancing flexibility in the manufacturing process.
Product Overview
This adhesive is part of the DENATITE series which boasts a long track record.
Benefit
Enable design flexibility and can significantly improve product lifespan.
Features
High heat resistance and high adhesion, with freely controllable fluidity
Value proposition
Mobility, Social Infrastructure, and Electric appliances
Inquiries about our products and technology
For inquiries about products (SDS, TDS, usage instructions, pricing, purchase information, catalogs, regulations, samples, etc.), technologies, and business collaboration, please check our dedicated website before submitting your inquiry.
Inquiries