Flat Panel Displays

Antistatic agents

Antistatic coating agent(Denatron Type-P,Type-C)

Transparent high conductive materials

Conductive coating agent(Denatron Type-P)

Conductive paste・ink(Denatron Type-P)

Epoxy adhesives

UV Light Curing Epoxy Resins

Photolithography (photoresist) material

Under Layer Material for Bi-layer Lift-off Processing―BLX Series

Photoresist for Single Layer Lift-off Processing: NPR9700 Series

Photoresist for UV Laser Direct Writing―GRX-M Series

Photolithography (Etching,remover) material

Resist Stripping Agents(N series)

Etching agents

Paste additives

Non-water-based chelation agents (Techrun)

Semiconductors

Adhesives

Acrylic polymers (TEISANRESIN)

Metal ion removal agents

Non-water-based chelation agents (Techrun)

Photolithography (photoresist) material

Under Layer Material for Bi-layer Lift-off Processing―BLX Series

Photoresist for Single Layer Lift-off Processing: NPR9700 Series

Photoresist for UV Laser Direct Writing―GRX-M Series

Photolithography (Etching,remover) material

Resist Stripping Agents(N series)

Etching agents

Epoxy sealants

Liquid Epoxy Encapsulant Material for Semiconductors

Epoxy Sheet Molding Compound

Antistatic agents

Antistatic coating agent(Denatron Type-P,Type-C)

Paste additives

Non-water-based chelation agents (Techrun)

High Frequency Devices

Hollow sealing sheets

Epoxy Sheet Molding Compound

Chassis and Packing Material

Antistatic agents

Antistatic coating agent(Denatron Type-P,Type-C)

3D printed electronics

3D modeling ink

3D printing material for visible light curing

Ag nano ink

OAG-series