Diverse Component Technologies that are the Foundation of Nagase ChemteX
Nagase ChemteX possesses a wide variety of component technologies backed up by our many years of abundant experience and know-how, and is moving forward with product development that combines those technologies to meet the needs of the market.
Our Research and Development head office is engaged in independent research activities related to applications of polymer synthesis, chemical modification, and simulation technology, while also promoting joint research projects with domestic and overseas universities and research institutions to actively take on the challenge of creating new technologies.
Epoxy Compound Design
Design and synthesis of epoxy compounds using epichlorohydrin
DENACOL series
Cross-linking agent for Super absorbent polymer, adhesives for tire cords, additives for coatings
Acrylic Polymer Design
Design and synthesis of acrylic resins by suspension polymerization of acrylic monomers
TEISANRESIN series
Adhesives for protection films and electronics materials
Conductive Material Design
Design and formulation of conductive coatings based on conductive polymers and nano carbons
Denatron series
Antistatic agent for optical films, electronics packages and traies
Photolithography Material Design
Material selection and preparation design from the perspective of finely and cleanly cutting patterns
Electrical and Optical Function Control
Material selection and preparation design for giving electrical and optical properties to formed patterns
Photolithography material
Photoresist for special processes (LED lift-off and mask rendering)
Thin Film Solvent Control
Material selection and preparation design for maximizing the solvent and anti-corrosion of the material on the substrate during the electronic device manufacturing process
ACT N series, N-300 series
Stripping agent for semiconductor and FPD manufacturing
Etchant
Etchant for packaging and FPD manufacturing
Epoxy Resin Preparation Design
Basic preparation design technology such as for epoxy resins and curing agents that are suitable for various applications
High Filler Filling and Preparation Design
High filler filling technology for low linear expansion coefficient and low viscosity
Compounding
Dispersion and mixing technology for making uniform resins, filler, etc.
Stress Relief Agent Preparation
Additive preparation technology for reducing stress in epoxy resins
Rheology Properties and Preparation Design
Rheology control technology for giving various workability for various applications術
Process Technology
Various processing technologies including cast molding, punching, and sheet forming
Epoxy resins for heavy electrical machinery
Insulation cast molding materials for power transmission/distribution transformers, etc.
Epoxy resins for electrical insulators
UL certified flame-retardant epoxy resins/resins for power modules
Non-flame-retardant epoxy resins/thermally conductive resins, etc.
Two-part liquid epoxy adhesives
Materials for wind power generators, structural adhesives, etc.
Epoxy resins for semiconductors
Liquid sealant resins for compression molding, underfill material, etc.
Sheet epoxy resins
Sheets for hollow seals, thermally conductive sheets, etc.
Ultraviolet curing resins
Sheet materials for displays and optical devices, etc.
Composite Material Design
Binder resin design for FRTP and FRTP design using these such as thermoplastic epoxy resin and in-place polymerization polyamide 6
Thermoplastic epoxy resin, in-place polymerization polyamide 6, UD carbon tape
Structural materials for automobiles, impact absorbing materials, reinforcing materials for civil engineering works, etc.
Organic-Inorganic Hybrid Material Design
Design and synthesis of hybrid materials that utilize the advantages of organic and inorganic materials focusing on silsesquioxane (SQ) derivatives
Materials for SQ molding, SQ-coating materials, SQ resin + nano particles
digital camera lenses, hard coatings, special coatings, and transparent encapsulant
Nano Material Design
Synthesis of novel nano particles, trial production of various dispersion elements, and design of compounding resins using these materials
TiO2 dispersion, ZrO2 dispersion, etc.
Microlenses, antireflection coatings, recordable media, etc.