Epoxy Sheet Molding Compound
Nagase ChemteX Corporation Epoxy Sheet is a material that
was developed in order to improve workability and simplify
processing in the usage environment while maintaining the
adhesiveness and heat resistance which are features of epoxy
resins by using various sheet forming technologies based on
liquid epoxy resin denaturing technology developed for
semiconductor, electronic, and electrical applications.
Features
The sheet material provides the following various functions and is able to ensure high functionality and high reliability.
Characteristics
- Flow control (vacuum, UF, etc.)
- Large surface area/thin film
Properties
- Display field
- High adhesiveness
- High thermal conductivity and high heat resistance
- High magnetic permeability
- Transparent
Furthermore, we are also able to propose total solutions that simultaneously deliver multiple functions by using multilayer sheets that are combinations of these.
Example Applications
Hollow electronic parts (high frequency devices, sensors, etc.), various modules, semiconductors (IC, power)
Inquiries
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