Liquid Epoxy Encapsulant Material for Semiconductors
We offer a lineup of the best products for various process methods including compression mold, underfill, and insulation-displacement connection, and which offer excellent reliability including solder flow resistance, heat resistance, and moisture resistance.
LMC: Liquid Molding Compound
- High flowability as suitable for large surface areas and thin film molds
- Liquid at room temperature and able to be dispensed, and dust-free as suitable for clean room environments
- Capable of low temperature form molding (125°C)
- Delivers low reflection in large surface area molds with low stress design
- High reliability
- High purity
- Low α line
Main Applications
- Fan-Out Wafer Level Package（FO-WLP）
- Over Molding for Chip on Wafer Process of 2.5D and 3D Packages
CUF: Capillary Under Fill
- Fast penetration speed even in narrow gaps
- No flow marks after curing
- High heat resistance
- High moisture resistance
- High wet reflow resistance
- High purity
- Low α line
NCP:Non-Conductive Paste
- Ultra-fast curing allows press connection in 5 seconds
- Excellent workability
- Supports multiple product types using only a dispenser
- High heat resistance
- High moisture resistance
- High purity
Inquiries
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