NEPCON JAPAN 2021-IC & SENSOR PACKAGING TECHNOLOGY EXPO

Our products will be exhibited at the NEPCON JAPAN 2021- IC & SENSOR PACKAGING TECHNOLOGY EXPO.
Please visit us at booth W12-12 during the show.

Exhibition Details

Date：Jan 20 (Wed) - 21(Fri), 2021 10:00-18:00 (Last day until 17:00)
Venue：Tokyo Big Sight, Japan
Booth number：W12-12

Our products to be displayed

• UV Curable Epoxy Encapsulant

• Liquid Epoxy Resin for Semiconductor Encapsulant

• Sheet Epoxy Resin for Electronic Component

• Epoxy Sheet for Semiconductor Encapsulant

• Flux Sheet

• Non-Cleaning Flux with Electronic Component Fastener Function

• Innovative Resin：Low Viscosity Benzoxazine

• Exceptional Toughness Cycloolefin Thermoset Resin