Our products will be exhibited at the NEPCON JAPAN 2018.
Please visit us at booth E25-28 during the show.

[Exhibition Details]

Date：Jan 17 (Wed) - 19(Fri), 2018 10:00-18:00 (Last day until 17:00)
Venue：Tokyo Big Sight, Japan
Booth number：E25-28

[Our products to be displayed]

■Epoxy Resin for Advanced Liquid Semiconductor Encapsulant
■Epoxy Sheet Encapsulant for semiconductor and electronic component
■UV Curable Sealant for Electronic Devices
■Epoxy Potting Materials for Automotive & Electronics Component
■High Performance Chemical for Photolithography Process
■Negative tone photo-resist for electroplating process
■High adhesion Ag nano-ink