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易解体性接着剤
Biroko
\ Explained by Biroko! /
Combines strong adhesion with easy removal.
Ideal for recycling and rework, as it allows parts to be peeled off cleanly and easily without damage.
Achieving a circular economy through enhanced recycling and rework processes
Minimal damage to components
Minimal damage to components
Disassembly solution is also recyclable
The disulfide bonds incorporated into the resin can be easily removed through repeated cutting and regeneration by a specialized disassembly solution, while still delivering the high bonding strength and excellent heat resistance required during normal use.
High Disassembly Performance
Superior Shear Bonding Strength
High Heat Resistance
Electrical Properties

※All characteristic values listed, except for data concerning easily removable adhesives, are provided as general reference measurements.
The listed values are for reference only and do not guarantee the performance of each material.
Performance may vary depending on conditions and environment; please verify thoroughly before actual use.

1
Bonding
Provides strong bonding of glass plates during use
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2
Immersion in disassembly solution
Simple peeling/disassembly achieved by immersion in solution
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3
Disassembly
After disassembly, only clean substrates can be recovered with no adhesive residue
Disassembly Mechanism
The disassembly solution contains components that cleave disulfide bonds. When substrates bonded with the easy-to-disassemble adhesive are immersed, bond rearrangement occurs and the connections are severed. Once rearrangement takes place, regenerative components restore the disassembly solution to its active state. The regenerated solution then continues to cleave additional disulfide bonds. Through this repeated process of shortening molecular chains, the easy-to-disassemble adhesive becomes increasingly soluble in the disassembly solution solvent.
Also explained in our video (please watch when you have time)
Chapter

Easy-to-disassemble adhesives offer various advantages over conventional bonding and removal technologies.
If you are considering replacing your current process, please consider our product.

粘着剤(両面テープ)
Adhesive Tape (Double-sided tape) Easy to remove but weak bonding strength
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With easy-to-disassemble adhesives
Strong bonding strength plus removable and decomposable
ホットメルト
Hot Melt Requires heating for bonding and removal, causing damage to components
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With easy-to-disassemble adhesives
Bonding and disassembly possible without thermal energy
ウレタン接着剤
Urethane Adhesive Complete removal is difficult, making rework challenging
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With easy-to-disassemble adhesives
High residue removal performance enables rework
接着剤剥離液(剥がし液)
Adhesive Remover (Stripping Solution) Contains harsh chemicals that can damage components
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With easy-to-disassemble adhesives
Mild disassembly solution causes minimal material damage
接着剤溶剤
Adhesive Solvent Difficult to recycle during disposal
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With easy-to-disassemble adhesives
Recyclable, making it sustainable
接着剤剥離剤
Adhesive Stripper Difficult to dispose of due to strict regulatory requirements for raw materials
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With easy-to-disassemble adhesives
Recyclable, significantly reducing waste volume

Easy-to-disassemble adhesives are expanding their applications across diverse fields, with unlimited potential.

Next-generation mobility
Industrial equipment
Construction and building materials
Coatings
Medical devices
Sports equipment
Electronic components
Automotive applications
The possibilities of easy-to-dismantle adhesives are endless!
For Those Interested in Easy-to-Disassemble Adhesives
カタログデータ
Request Catalog Data If you would like a detailed catalog containing physical properties and application methods for easy-to-disassemble adhesives, please contact us here.
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相談したい
Technical Consultation for Implementation If you would like technical consultation or pricing information for implementation, please contact us here.
Consultation Here
共同研究の相談をしたい
Joint Research Consultation If you are interested in developing new products using easy-to-disassemble adhesives or exploring collaborative research opportunities, please contact us here.
Consultation Here
For any other inquiries, please feel free to contact us here For any other inquiries
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