Biroko
Ideal for recycling and rework, as it allows parts to be peeled off cleanly and easily without damage.
Technology that enables easy disassembly is crucial to building a sustainable society. Nagase ChemteX is advancing the development of Easily dismantlable adhesive that can be used with various substrate combinations such as resin-to-metal, metal-to-metal, and resin-to-resin bonding, which are utilized in next-generation mobility solutions, automotive applications (vehicle components), construction and building materials, medical devices, sporting goods, and electronic components. By enhancing recycling efficiency, we support corporate sustainability initiatives.
※All characteristic values listed, except for data concerning Easily dismantlable adhesive, are provided as general reference measurements.
The listed values are for reference only and do not guarantee the performance of each material.
Performance may vary depending on conditions and environment; please verify thoroughly before actual use.
Easily dismantlable adhesive
The disassembly solution contains components that cleave disulfide bonds. When substrates bonded with the Easily dismantlable adhesive are immersed, bond rearrangement occurs and the connections are severed. Once rearrangement takes place, regenerative components restore the disassembly solution to its active state. The regenerated solution then continues to cleave additional disulfide bonds. Through this repeated process of shortening molecular chains, the Easily dismantlable adhesive becomes increasingly soluble in the disassembly solution solvent.
and Removal Technologies
Easily dismantlable adhesive offers various advantages over conventional bonding and removal technologies.
If you are considering replacing your current process, please consider our product.
Applications for Easily dismantlable adhesive are expanding across diverse fields, with unlimited potential.