Under Layer for Bi-Layer ProcessBLX-210

Features

Reduced coating volume (good application).

Reduced defects (low solvent volatility suppresses particles during application).

Low temperature baking (no intermixing during baking below 140℃).

Good undercut adjustment (easy adjustment with development time).

Good peelability (low-temperature baking ensures good peelability).

Good EBR cleaning

Process Condition
Under
layer		 Substrate 5inch Bare Si wafer
Coating materials BLX-210
Coating method Spin coating
Pre-baking 125 - 165℃, 120s on Hotplate
Film thickness 0.2 - 0.8μm
Upper
layer		 Coating material Positive type of Photoresist
Coating method Spin coating
Prebaking 90℃, 90s on Hotplate
Film thickness 0.8μm
Double
layer		 Exposure NSR-TFHi12, (i-line stepper), NA=0.45, σ=0.6
Development 2.38%TMAH, 23℃, 30 - 70s, Single Puddle
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Spin curve

Spin curve

Product Range

Product Range

Film Thickness Uniformity

uneven coating

Dropping volume 2cc 3cc
BLX -3μm 0μm
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Unevenness of application compared to other companies' products, leading to a reduction in the amount of coating.

in-plane film thickness uniformity

Dropping volume 2cc 3cc
BLX -3μm [Average film thickness] 8,071Å
【σ】12.9Å 		0μm [Average film thickness] 7,858Å
【σ】9.9Å
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Higher in-plane film thickness uniformity than other companies' products, leading to a reduction in coating volume.

①Under-Layer thickness

  • 0.2μm
    0.2μm
  • 0.4μm
    0.4μm
  • 0.6μm
    0.6μm
  • 0.8μm
    0.8μm
Under-Layer thicknes
*No intermixing between the upper layer and the under-Layer film.

②Pre-bake Temperature

  • 125℃
    125
  • 135℃
    135
  • 145℃
    145
  • 155℃
    155
  • 165℃
    165
Pre-bake Temp
*Be able to control the under-cut length with pre-bake temperature.

③Development time

  • 30sec
    30sec
  • 40sec
    40sec
  • 50sec
    50sec
  • 60sec
    60sec
  • 70sec
    70sec
Development time
*Be able to control the under-cut length with development time.

Pre-bake Temp. VS Removability

Sample Dissolution rate for NMP (Å/s)
180℃ bake 140℃ bake
BLX 7.6 27.9
Other maker product 8.0 N/A
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Case: under-layer thickness = 2,500Å

Sample Complete dissolution time for NMP (s)
180℃ bake 140℃ bake
BLX 329 90
Other maker product 312 N/A
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*Competitor's products cause intermixing with the upper layer during low temperature baking , and cannot be remove or be disolved.