Semiconductor encapsulation material(Liquid Molding Compound)

Our semiconductor encapsulants are used in advanced semiconductor fields, contributing to the acceleration of computational processing, energy efficiency, and miniaturization of various devices, thereby contributing to the realization of a super-smart society.

Flexible supply form

LMC Liquid Molding Compound

・Mass production track record for WLP
・Warpage control
・High flowability (narrow gap penetration)
・Low temp molding (125°C IMC)

a-SMC advanced-Sheet Molding Compound

・Warpage control
・High flowability (narrow gap penetration)
・Improved MUF performance
・Chemical resistance
・High toughness
・compatible with panel process

General IC CUF：Capillary Under Fill

・High penetration speed even with narrow gaps
・No flow marks after curing
・High heat resistance
・High moisture resistance
・High moisture reflow resistance
・High purity
・Low alpha ray

Changing needs for encapsulating materials

Supporting highly integrated packaging roadmap We provide optimal encapsulation solutions for the most advanced semiconductor packaging technologies.

Innovation in encapsulation materials

Solving various issues in plastic packaging with material technology As semiconductor devices become more and more complex, packaging challenges vary from customer to customer. We will address a wide range of challenges based on the epoxy resin modification technologies we have developed over the years.

Increased complexity of
semiconductor package structures

Functions required for
semiconductor encapsulants

Warpage control

Filling performance

Reliability

Solutions for Various Devices

Covering wafer level to single chip encapsulation In the manufacturing processes of various devices, there are various needs related to workability. We can provide materials that are compatible with various processes while maintaining high reliability.

Process

Compression

Products

LMC Liquid Molding Compound