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Liquid and sheet encapsulation materials for RF modules

We offer both liquid and sheet-type epoxy encapsulation materials for RF modules.
To meet the growing needs of component assembly for miniaturization, low profile, and high density, we propose encapsulation materials with low pressure and high flowability, along with the most suitable manufacturing process.
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Epoxy for Electronics
We customize our products to meet your requirements and needs. Please feel free to contact us for a consultation.
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