Liquid and sheet encapsulation materials for RF modules
We offer both liquid and sheet-type epoxy encapsulation materials for RF modules.
To meet the growing needs of component assembly for miniaturization, low profile, and high density, we propose encapsulation materials with low pressure and high flowability, along with the most suitable manufacturing process.
To meet the growing needs of component assembly for miniaturization, low profile, and high density, we propose encapsulation materials with low pressure and high flowability, along with the most suitable manufacturing process.
Required specifications
Issues
- ・Components sensitive to pressure
- ・Chip-to-chip distance reduction due to high-density mounting
- ・Narrow pitch of terminals in mounted components
Requirements
- ・Low temp and low pressure molding
- ・High flowability
- ・Control of filler particle size
Encapsulation materials for RF modules
| Transfer | Compression | Laminate | ||
|---|---|---|---|---|
|
Tablet
|
〇 | |||
|
Granule
|
〇 | |||
|
Liquid
|
〇 | 〇 | ||
|
Sheet
|
〇 | 〇 |
We offer the following two types of encapsulation materials for compression molding.
- ・LMC (Liquid Molding Compound)
- ・a-SMC (advanced Sheet Molding Compound)