Encapsulation materials for power modules

Contributing to the long lifespan of power modules Power modules are adopted in various fields such as mobility, renewable energy, and industrial equipment, and the improvement of their reliability and lifespan is a critical issue. Particularly in recent years, the adoption of SiC has increased, leading to higher chip drive temperatures.
As a result, higher reliability is required for power modules, and encapsulants must meet these reliability requirements as well. Since power modules are composed of various materials, controlling internal stress generated by thermal cycles, ensuring adhesion with different materials, and maintaining long-term high-temperature durability are extremely important for encapsulants. We have a proven track record in encapsulants for power modules and are committed to further advancing the development of these key technologies.

Value proposition

Contributing to improved productivity

In the encapsulation process, improving productivity is also crucial. Therefore, we are focusing on developing encapsulants that not only offer high reliability but also consider ease of handling and workability.

Environmentally-conscious key technologies

Chemical regulations are becoming increasingly stringent worldwide, including in the EU. In addition to complying with regulations such as REACH, we are actively developing environmentally-friendly materials. Furthermore, we are working on the development of key technologies that achieve flame retardancy while being halogen-free.

Technologies

High Flowability：low-viscosity, high-flow liquid resins for improved productivity
Flame Retardancy：Flame-retardant properties at V-0 level
Aging resistance：High-level reliability with tests such as TST (Thermal Shock Test), PCT (Power Cycle Test), and THB (Thermal Humidity Bias test)

Technological trend shifts

Technological trends in next-generation power modules

Issues faced by customers

By applying epoxy resins as encapsulants, we contribute to the extended lifespan of power modules.

1. Improved water resistance Prevention of performance degradation in high temperature and high humidity environments

2. Improved sulfur resistance Prevention of failure due to migration

3. Improved vibration resistance Improvement of peel resistance at dissimilar material joints

4. Improved TST and PCT resistance Prevention of damage to joints, such as Si/SiC, solder, and sintered silver, in harsh environments

"Why is extending lifespan important?"

・Differentiating from competitors in the highly competitive power device market
・By extending the product lifespan, it is possible to reduce maintenance and replacement frequency, thereby lower the total cost for the system.

Conventional structure

Epoxy resin applied structure