Room Temp Curing Adhesive
<High Adhesion Type>
Achieve excellent adhesive strength comparable to heat curing. Cures at room temp and strongly bonds materials with different properties.
Eliminate the need for a heat curing process, contributing to a reduction in environmental impact.
Room temp curing available
Reduce energy consumption and CO2 emissions during heat curing, addressing the need for a lower environmental impact.
Our materials eliminate the need for a thermosetting process using curing ovens or heat guns, contributing to cost reduction.
High adhesive strength
Achieving high adhesive strength comparable to heat curing at room temp.
Enable bonding of dissimilar materials, such as CFRP and aluminum, for lightweight components.
An ideal failure mode is cohesive failure, where residues remain on both sides of the adhesive fracture surface.
Al-CFRP
The failure mode was a mix of cohesive failure (adhesive material failure) and material failure (failure of the adherent itself), which represents an ideal failure state.
Al-CFRP
| Item | Resin | Hardener |
|---|---|---|
| Appearcance | Black paste | Milky white paste |
| Viscosity （25℃） | 130 Pa・s | 130 Pa・s |
| Mixing ratio | 100 | 50 |
| Potlife（25℃） | 60min. | |
※Curing condition : 100℃/30 min
Application examples
