Materials for electric applications
We offer a wide range of products and various techniques for automotive and electronic components, including epoxy resins tailored for ECUs, sensors, motors, power devices, reactors, and more. These products provide diverse properties such as high heat resistance, low coefficient of thermal expansion, high thermal conductivity, and flexibility to meet various requirements.
Applicatoin examples in automotive electronic components and FA industrial equipment
Product expansion in rapidly advancing electrification and high performance fields
Epoxy resins are required to meet a wide range of performance demands, including heat resistance, heat cycle durability, low thermal expansion, and high thermal conductivity, ensuring high reliability for applications such as casting, encapsulation, and adhesion.
Our encapsulation resins supporting advances in mounting technology
Optimal process and material solutions aligned with the mounting roadmap
Potting technology is ideal for processing small quantities of a wide variety of components, allowing efficient handling of different types and sizes of parts. Furthermore, by combining techniques such as dam & fill, underfill, and sidefill, it is possible to address partial encapsulation of composite substrates and reinforcement of components.
Overall encapsulation
Mass production requires molding equipment
Molding compound
※Other companies' process
Overall encapsulation
Suitable for small quantities of various parts
Potting
Partial encapsulation
Partial encapsulation of composite substrates
Dam & Fill
To adapt to the transformation of mounting technologies, We offer total solutions for component encapsulation by combining resin discharge onto substrates with curing processes, focusing on fluid control technology for liquid encapsulation resins.
BOA
BGA
QFN
Partial encapsulation
- ・Sidefill
- ・Underfill
To enhance mounting reliability on boards, we provide space filling materials (secondary mounting underfill materials) for reinforcement.
- ・Fixing of SoC and various electronic components
- ・Improvement of solder life
- ・Options for high heat resistance or low temp curing
- ・Long pot life.
