Applicatoin examples in
automotive electronic components and FA
industrial equipment
Our encapsulation resins supporting advances
in mounting technology

Materials for electric applications

We offer a wide range of products and various techniques for automotive and electronic components, including epoxy resins tailored for ECUs, sensors, motors, power devices, reactors, and more. These products provide diverse properties such as high heat resistance, low coefficient of thermal expansion, high thermal conductivity, and flexibility to meet various requirements.

Applicatoin examples in automotive electronic components and FA industrial equipment

Product expansion in rapidly advancing electrification and high performance fields Epoxy resins are required to meet a wide range of performance demands, including heat resistance, heat cycle durability, low thermal expansion, and high thermal conductivity, ensuring high reliability for applications such as casting, encapsulation, and adhesion.

Our encapsulation resins supporting advances in mounting technology

Optimal process and material solutions aligned with the mounting roadmap Potting technology is ideal for processing small quantities of a wide variety of components, allowing efficient handling of different types and sizes of parts. Furthermore, by combining techniques such as dam & fill, underfill, and sidefill, it is possible to address partial encapsulation of composite substrates and reinforcement of components.

Overall encapsulation

Mass production requires molding equipment

Molding compound

※Other companies' process

Overall encapsulation

Suitable for small quantities of various parts

Potting

Partial encapsulation

Partial encapsulation of composite substrates

Dam & Fill

To adapt to the transformation of mounting technologies, We offer total solutions for component encapsulation by combining resin discharge onto substrates with curing processes, focusing on fluid control technology for liquid encapsulation resins.