Selective Cleaning Technology

We propose a technology that selectively cleans various combinations of metals and resins at the nano level while minimizing damage.

Selective cleaning refers to the process of making what is needed and removing what is unnecessary. For example, when washing the face in daily life, sebum contamination should be removed while a certain amount of oil should remain. Similarly, selective cleaning is required in the cleaning process in the industrial field. However, there is often a trade-off between increasing the removability of specific substances (stains) and reducing damage to the base material to which the stains are attached. The difficulty of this process increases as the variety of stains and base materials grows.
Materials used in the manufacturing process of semiconductors, semi-metals, FPDs, etc. often produce devices with multiple layers of different metals. The problem in this process is galvanic corrosion, in which the solubility of only certain metals increases due to the difference in ionization tendency between the metals in contact with each other. Selective corrosion protection is a method to suppress this galvanic corrosion. Selective residue removal removes only the residue of other specific metals and polymers and does not damage others. There is also a need for etch roughness control, which adjusts the surface roughness after the metal is etched, and constant velocity etching, which dissolves several different metals at the same rate. Our selective cleaning technology can meet them.

Four Selective Cleaning Technologies Proposed by NAGASE

Selective Corrosion Protection
Selective Corrosion Protection
Capable of dissolving or protecting only the target object among contacting dissimilar metals and resins
Etching Rate Control
Etching Rate Control
Surface roughness after etching can be controlled according to your requirements
Selective Residue Removal
Selective Residue Removal
Capable of removing only the target object without damaging the protected object
Isotropic etching
Isotropic etching
Capable of etching different metals at the same rate

Application Example of Selective Etching Technology

Technical introduction: suppression of Galvanic corrosion (Dissimilar metal contact corrosion)
Utilizing formulation technology, we have developed chemical components that prevent the dissolution of metals with different ionization tendencies, thereby suppressing galvanic corrosion.
Generic product
The base metal (Mo) selectively dissolves
Generic product The base metal (Mo) selectively dissolves
Cu
Mo
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NAGASE's product
No galvanic corrosion
NAGASE's product No galvanic corrosion
No Mo corrosion
Cu
Mo
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Additionally, we can suppress galvanic corrosion that occurs with various combinations of metals such as Au and Ni, and Au and Ti. For more details, please contact us.

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