Precision Cleaning Technology
Device cleaning at the nano level with precision is possible.Particularly in the fields of advanced materials and electronic components, the need to remove contaminants on the order of submicrons to nanometers (and sometimes even lower), which are invisible to the eye, is increasing as structures become increasingly miniaturized. In these fields, the use of appropriate chemicals and the establishment of cleaning processes are very important, as ultra-fine contaminants and ionic residues can cause fatal defects in the products.
NAGASE's precision cleaning technology makes it possible to remove such ultra-fine contaminants and to develop chemical solutions that improve product reliability and quality.
Application Examples of Precision Cleaning Technology
NAGASE controls metal specifications and the number of particles in the cleaning solution to achieve a normal cleaning finish that meets customer requirements, and proposes chemical solutions that can remove difficult-to-remove contaminants without causing damage.
Cleaning Example: Removal of UV-Cured Resin After Heat Treatment on Silicon Wafer (Laser Microscope Image)
Cleaning Example: Removal of Fine Particles on Silicon Wafer (Residue Count on Wafer)
Comparing the conventional residue amount of 0~0.1un as 100%
The improved product significantly reduces residue
