Glossary
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FPD (Flat Panel Display)
A generic term for flat screen imaging devices. Includes liquid crystal displays, organic electroluminescent displays, and electronic paper. In recent years, smartphones and tablets with touch sensors embedded in FPDs have become popular.
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CD (Critical Dimension)
Critical Dimension. A value indicating the dimensional change of metal wiring patterns before and after chemical treatment. It is mainly used in the semiconductor industry in expressions such as “CD loss (dimensional shift)".
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BARC (Bottom Anti-Reflective Coating)
Bottom Anti-Reflective Coating. Used to prevent light reflection from the underlying layer that occurs during the photolithography process.
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MC (Molding Compounds)
Molded resin. Used to protect semiconductor devices.
LMC(Liquid Molding Compound)
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PI (Polyimide)
Polyimide. It is widely used in many electronic material industries as well as in the semiconductor field. It is known for its high heat resistance, electrical insulation, abrasion resistance, and dimensional stability.
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MHM (Metal Hard Mask)
Metal hard mask. Metal hard masks are used in cases where it is difficult to form and maintain patterns with conventional photomasks due to the shortening wavelengths of exposure equipment and the consequent miniaturization of formation patterns. There are many examples of use in the insulating film processing process in the field of logic semiconductors, etc., and we receive many inquiries about them.
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DIW（De-ionized Water）
De-ionized water
