Chemicals for electronic components, optical components and FPD processes
In the fields of electronic components, optical components, and FPDs, metal wiring is often formed using the photolingraphy process. Different industries use various types of photoresists and have specific cleaning needs for different processes. We can provide photoresist removers and etchants to meet a wide variety of needs. The flow chart below shows how to select a photoresist remover for each type of resist that we offer. Since the items we propose will vary depending on the resist type and process, please refer to the flow chart and contact us for details.
We offer a group of chemicals to solve issues in the manufacturing process for the various electronic parts FPD to be used.
Photolithography process
The electronic components and FPD industries use the photolingraphy process to form integrted circuits.
The following figure illustrates a subtractive process. The chemicals required for the developing, stripping, and etching —namely developer, stripper, and etchant— are available.
Metal wiring (SEM)
The photolithography process requires four main chemicals
Photolithography Stripper Lineup (by resist type)
Other chemical solutions will vary depending on the materials and metal types they come into contact with, so please contact us for details.
*Please inquire separately about etchants such as ITO and aluminum.
Product Information
Stripper for photoresist N-300
N-300 is a non-aqueous photoresist stripper; N-300 can strip photoresist with almost no corrosion of Al or Si.
feature
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Excellent removability from photoresist
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Low damage to Al
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Low damage to a-Si and poly-Si
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specific gravity(25℃):0.97
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viscosity(25℃)10mPa/S
Process example
Dip or Shower
Dip or Shower
Dip or Shower
Example of removing
Notes.
Please read the SDS before use.
Stripper for photoresist N-342
N-342 is a water-based release agent for photoresists. N-342 is suitable when Al corrosion is likely to occur during removal. N-342 can be used for a long time by moisture control and is an environmentally friendly release agent.
feature
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Excellent removability from photoresist
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Not classified as hazardous under the Fire Service Act
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Can be rinsed directly after removing
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Bath life can be extended through moisture management
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specific gravity(25℃):0.99
-
viscosity(25℃)10mPa/S
Process example
Shower
0.5~5min
Shower
Shower
Shower
Example of removing
Notes.
Please read the SDS before use.
