SiC polishing abrasive

Matelials of griding and polisshing

The hexagonal α-type crystal is just below diamond in terms of hardness, and its chemical stability is excellent at room temperature. The result is a product with superior lapping and polishing capabilities, which is not affected by chemicals, and can spontaneously generate sharp grinding edges through fragmen-tation.
GC is well suited for use as the slicing of Si ingot, and the processing of materials ranging from ultra hard metals and edged tools to soft metals such as brass and other copper alloys.
But that's not all, GC is used in the processing of various resins as well.

SiC polishing abrasive

Whetstone lap cutting