Matelials of griding and polisshing
This product is manufactured in a consistent manufacturing process from raw material production to sizing.
It is a stable quality product featuring a uniform shape, particle size distribution and wear resistance across all sizes.
This abrasive grain is suitable for precision machining of superalloy dies, optical lenses, and polishing of difficult-to-cut materials.
We propose particle size and micron grade according to the application.
* We also handle other cBN abrasive grains
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Products similar to this product
Products related to this product
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Polishing pad
This product is specialized for ultra-precision polishing of silicon wafers, semiconductor materials, metals and glass.
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Diamond wire
Diamond wire is an abrasive material made by solidifying diamond powder on the wire by electrodeposition.
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Saw wire
We have a variety of saw wires as cutting materials.