Polishing Similar products
The probe card is used in the semiconductor wafer inspection process.
However, the probe card cannot continue to function without cleaning the probe parts after a certain period of using.
The probe cards are becoming more pin-counter and narrower in pitch with the recent improvement in semiconductor performance.
Therefore, Cleaning sheets are of increasing importance as it extend the life of expensive probe cards.
We supply the optimum sheet for cleaning the probe card and have many achivements of being used by many semiconductor related manufacturers.
We support a wide range of lineups for cleaning various types of needle tips.
- Cleaning with less wear is possible
- Supports various types of needle tip cleaning. There is also a lineup of types that can be used at high temperatures
- Can be attached to wafers and polishing plates
Lineup
| Sheet type | Seat model | Average particle size (µm) | Base material | Color | Adhesive |
|---|---|---|---|---|---|
| PET Type | WA4000-75 TEZ-G | 3.0 | PET | Yellow | Ordinary temperature specifications |
| WA6000-75 TEZ-A | 2.0 | White | |||
| WA8000-75 TEZ-B | 1.0 | Light pink | |||
| GC6000-75 FEY-B | 2.0 | Gray | |||
| PF3 Type | GC4000-PF3 FEY-A | 3.0 | Polyurethane foam | Gray | Heat resistant specifications |
| GC6000-PF3 FEY-A | 2.0 | Gray | |||
| GC8000-PF3 FEY-A | 1.0 | Brown | |||
| SI10000-PF3 FEY-A | 0.5 | Orange | |||
| SWE Type | WA4000-SWE FWX | 3.0 | Polyurethane foam | Yellow | Ordinary temperature specifications |
| WA6000-SWE FWX | 2.0 | Green | |||
| WA8000-SWE FWX | 1.0 | Pink | |||
| SI10000-SWE FWX | 0.5 | Orange | |||
| BC3 Type | GC4000-BC3 FEZ-C | 3.0 | PET+Polyolefin | Gray | Ordinary temperature specifications |
| GC6000-BC3 FEY-B | 2.0 | Gray | |||
| GC8000-BC3 FEY-A | 1.0 | Gray | |||
| GC10000-BC3 FEY-A | 0.5 | Gray |
PET Type
| Lineup | Features |
|---|---|
| ・WA4000-75 TEZ-G ・WA6000-75 TEZ-A ・WA8000-75 TEZ-B ・GC6000-75 FEY-B |
・Structure of wrapping film + adhesive layer. ・Supports cantilever flat-shaped products. ・Structure suitable for removing strong deposits. ・Applicable to wafer attachment and polishing stage attachment. |
| Structure | |
 |
|
PF3 Type
| Lineup | Features |
|---|---|
| ・GC4000-PF3 FEY-A ・GC6000-PF3 FEY-A ・GC8000-PF3 FEY-A ・SI10000-PF3 FEY-A |
・The polishing layer is formed directly on the flat cushion layer. ・Effective needle tip cleaning with low damage. ・Applicable regardless of card type or needle tip shape. |
| Structure | |
 |
|
SWE Type
| Lineup | Features |
|---|---|
| ・WA4000-SWE FWX ・WA6000-SWE FWX ・WA8000-SWE FWX ・SI10000-SWE FWX |
・The polishing layer is formed directly on the bumpy cushion layer. ・Effective needle tip cleaning with low damage. ・Structure suitable for cantilever and vertical type probe cards. ・Compatible with round and crown needle tips. |
| Structure | |
 |
|
BC3 Type
| Lineup | Features |
|---|---|
| ・GC4000-BC3 FEZ-C ・GC6000-BC3 FEY-B ・GC8000-BC3 FEY-A ・GC10000-BC3 FEY-A |
・Structure of wrapping film + adhesive layer ・Effective needle tip cleaning with low damage ・Structure suitable for cantilevers |
| Structure | |
 |
|